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SC668
Applications Information (continued)
PCB Layout Considerations
The layout diagram in Figure 16 illustrates a two-layer
PCB layout for the SC668 and supporting components.
Following fundamental layout rules is
critical for achieving the performance specified in the
Electrical Characteristics table. The following guidelines
are recommended when developing a PCB layout:
?
Place all bypass and decoupling capacitors —
C IN , C LDO1 , C LDO2 , C LDO3 , C LDO4 , and C BYP as close to
the device as possible.
?
Ensure that all connections to pins IN and OUT
make use of wide traces so that the resistive
drop on each connection is minimized.
?
The thermal pad should be connected to the
ground plane using multiple vias to ensure
proper thermal connection for optimal heat
transfer.
?
The following capacitors — C LDO1 , C LDO2 , C LDO3 ,
C LDO4 , and C BYP should be grounded together.
Connect these capacitors to the ground plane at
?
?
Figure 17 shows the component copper layer.
Make all ground connections to a solid ground
plane as shown in Figure 18.
All LDO output traces should be made as wide
as possible to minimize resistive losses.
one point near the SC668 as shown in Figure 16.
Figure 17 — Layer 1
Ground
Plane
CLDO2
CLDO3
CLDO4
CBYP
CLDO1
VIN
GND
CIN
LDO1
VIN
GND
BL8
BL7
GND
SC668
PWM
SDA
SCL
ADI
BL1
Figure 16 — Recommended PCB Layout
Figure 18 — Layer 2
23
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